Mixed - Signal Testing in MCM - DMicrosystemsHans
نویسنده
چکیده
| A high-density silicon-substrate multi-chip module construction is shown which provides new features for testing the assembled mixed-signal bare dies and integrated passive devices. Among these features are enhanced possibilities for testing bare dies not equipped with boundary-scan cells. Additionally, relatively simple means for electron-beam diagnosis become possible. The approach uses a completely planar host-guests implementation and employs the silicon substrate for implementing boundary-scan cells.
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تاریخ انتشار 2007